Datasheet

Electrical parameters STM8L15xx8, STM8L15xR6
74/134 DocID17943 Rev 6
I
DD(RUN)
Supply
current
in Run
mode
All
peripherals
OFF, code
executed
from Flash,
V
DD
from
1.65 V to
3.6 V
HSI RC
osc.
(9)
f
CPU
= 125 kHz
0.35 0.46 0.48 0.51 0.59
mA
f
CPU
= 1 MHz
0.54 0.65 0.67 0.7 0.78
f
CPU
= 4 MHz
1.16 1.27 1.29 1.32 1.4
f
CPU
= 8 MHz
1.97 2.08 2.1 2.13 2.21
f
CPU
= 16 MHz
3.54 3.65 3.67 3.7 3.78
HSE
external
clock
(f
CPU
=f
HSE
)
(8)
f
CPU
= 125 kHz
0.35 0.44 0.46 0.49 0.58
f
CPU
= 1 MHz
0.53 0.62 0.64 0.67 0.76
f
CPU
= 4 MHz
1.13 1.22 1.24 1.27 1.36
f
CPU
= 8 MHz
2 2.09 2.11 2.14 2.23
f
CPU
= 16 MHz
3.69 3.78 3.8 3.83 3.92
LSI RC osc.
f
CPU
= f
LSI
0.110 0.123 0.130 0.138 0.180
LSE external
clock
(32.768
kHz)
(10)
f
CPU
= f
LSE
0.100 0.101 0.104 0.119 0.163
1. All peripherals OFF, V
DD
from 1.65 V to 3.6 V, HSI internal RC osc., f
CPU
=f
SYSCLK
2. For devices with suffix 6
3. For devices with suffix 7
4. For devices with suffix 3
5. CPU executing typical data processing
6. The run from RAM consumption can be approximated with the linear formula:
I
DD
(run_from_RAM) = Freq. * 95 µA/MHz + 250 µA
7. Tested in production.
8. Oscillator bypassed (HSEBYP = 1 in CLK_ECKCR). When configured for external crystal, the HSE consumption
(I
DD HSE
) must be added. Refer to Ta ble 31.
9. The run from Flash consumption can be approximated with the linear formula:
I
DD
(run_from_Flash) = Freq. * 200 µA/MHz + 330 µA
10. Oscillator bypassed (LSEBYP = 1 in CLK_ECKCR). When configured for external crystal, the LSE consumption
(I
DD LSE
) must be added. Refer to Table 32
Table 20. Total current consumption in Run mode (continued)
Symbol
Para
meter
Conditions
(1)
Typ.
Max.
Unit
55°C
85 °C
(2)
105 °C
(3)
125 °C
(4)