Datasheet
DocID17943 Rev 6 11/134
STM8L15xx8, STM8L15xR6 Description
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2.2 Device overview
Table 2. High density and medium+ density STM8L15xx low power device features and
peripheral counts
Features STM8L15xC8 STM8L15xR8 STM8L15xM8 STM8L15xR6
Flash (Kbytes) 64 64 64 32
Data EEPROM (Kbytes) 2 1
RAM (Kbytes) 4 4 4 2
LCD 8x24 or 4x28
(1)
8x36 or 4x40
(1)
8x40 or 4x44
(1)
8x36 or 4x40
(1)
Timers
Basic
1
(8-bit)
1
(8-bit)
1
(8-bit)
1
(8-bit)
General purpose
3
(16-bit)
3
(16-bit)
3
(16-bit)
3
(16-bit)
Advanced control
1
(16-bit)
1
(16-bit)
1
(16-bit)
1
(16-bit)
Communication
interfaces
SPI 2 2 2 2
I2C 1 1 1 1
USART 3 3 3 3
GPIOs 41
(2)
54
(2)
68
(2)
54
(2)
12-bit synchronized ADC
(number of channels)
1
(25)
1
(28)
1
(28)
1
(28)
12-Bit DAC
Number of channels
2
2
2
2
2
2
2
2
Comparators (COMP1/COMP2) 2 2 2 2
Others
RTC, window watchdog, independent watchdog,
16-MHz and 38-kHz internal RC, 1- to 16-MHz and 32-kHz external oscillator
CPU frequency 16 MHz
Operating voltage
1.8 to 3.6 V (down to 1.65 V at power-down) with BOR
1.65 to 3.6 V without BOR
Operating temperature
− 40 to +85 °C / − 40 to +105 °C / − 40 to +125 °C
Packages
UFQFPN48
LQFP48
LQFP64 LQFP80 LQFP64
1. STM8L152xx versions only.
2. The number of GPIOs given in this table includes the NRST/PA1 pin but the application can use the NRST/PA1 pin as
general purpose output only (PA1).