Datasheet

STM809/810/811/812
10/18
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings” table may cause per-
manent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating con-
ditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality docu-
ments.
Table 3. Absolute Maximum Ratings
Note: 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150
seconds).
Symbol Parameter Value Unit
T
STG
Storage Temperature (V
CC
Off)
–55 to 150 °C
T
SLD
(1)
Lead Solder Temperature for 10 seconds 260 °C
V
IO
Input or Output Voltage
–0.3 to V
CC
+0.3
V
V
CC
Supply Voltage –0.3 to 7.0 V
I
O
Output Current 20 mA
P
D
Power Dissipation 320 mW