Datasheet

Maximum ratings STM6700, STM6710
12/21 Doc ID 16887 Rev 2
3 Maximum ratings
Stressing the device above the rating listed in Ta bl e 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in Table 4 of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability. Refer
also to the STMicroelectronics™ SURE program and other relevant quality documents.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
T
STG
Storage temperature (V
CC
off) –55 to +150 °C
T
SLD
(1)
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Lead solder temperature for 10 seconds 260 °C
V
IO
Input or output voltage –0.3 to V
CC
+0.3 V
V
CC
Supply voltage –0.3 to +7.0 V V
I
O
Output current 20 mA
θ
JA
Thermal resistance (junction to ambient) N/A °C/W