Datasheet

Package footprint STM6522

18/25 Doc ID 17045 Rev 3

7 Package footprint

Figure 14. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad

Table 7. Parameters for landing pattern - TDFN – 8-lead 2 x 2 mm package

Parameter Description

Dimension (mm)

Min. Nom. Max.

L Contact length 1.05

— 1.15

b Contact width 0.25

— 0.30

E Max. land pattern Y-direction

— 2.85 —

E1 Contact gap spacing — 0.65 —

D Max. land pattern X-direction — 1.75 —

P Contact pitch — 0.5 —

AM00441

E1E