Datasheet

Package footprint STM6513

22/29 Doc ID 16490 Rev 2

9 Package footprint

Figure 14. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad

Table 8. Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm package

Parameter Description

Dimension (mm)

Min. Nom. Max.

L Contact length 1.05

—

1.15

b Contact width 0.25

—

0.30

E Max. land pattern Y-direction

—

2.85

—

E1 Contact gap spacing

—

0.65

—

D Max. land pattern X-direction

—

1.75

—

P Contact pitch

—

0.5

—

AM00441

E1E