Datasheet

Maximum rating STM6513
16/29 Doc ID 16490 Rev 2
6 Maximum rating
Stressing the device above the rating listed in the Table 3: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
T
STG
Storage temperature (V
CC
off) –55 to +150 °C
T
SLD
(1)
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 s.
Lead solder temperature for 10 seconds 260 °C
θ
JA
Thermal resistance (junction to ambient) TDFN8 149.0 °C/W
V
IO
Input or output voltage –0.3 to 5.5
(2)
2. For RST1 –0.3 to V
CC
+0.3 V only.
V
V
CC
Supply voltage –0.3 to 7 V