Datasheet

Package characteristics STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC
126/132 DocID022799 Rev 6
Figure 46. Thermal resistance
7.2.1 Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
MS31405V2
0.00
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100 75 50 25 0
WLCSP63
LQFP64 10x10mm
UFBGA100 7x7mm
Temperature(°C)
PD (mW)
Forbidden area
TJ > TJ max