Datasheet

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STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC Package characteristics
131
7.2 Thermal characteristics
The maximum chip-junction temperature, T
J
max, in degrees Celsius, may be calculated
using the following equation:
T
J
max = T
A
max + (P
D
max × 
JA
)
Where:
 T
A
max is the maximum ambient temperature in C,

JA
is the package junction-to-ambient thermal resistance, in C/W,
 P
D
max is the sum of P
INT
max and P
I/O
max (P
D
max = P
INT
max + P
I/O
max),
 P
INT
max is the product of I
DD
and V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/O
max represents the maximum power dissipation on output pins where:
P
I/O
max = (V
OL
× I
OL
) + ((V
DD
– V
OH
) × I
OH
),
taking into account the actual V
OL
/ I
OL
and V
OH
/ I
OH
of the I/Os at low and high level in the
application.
Table 72. Thermal characteristics
Symbol Parameter Value Unit

JA
Thermal resistance junction-ambient
UFBGA100 - 7 x 7 mm
59
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
43
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
WLCSP63 - 0.400 mm pitch
49
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
55
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
16