Datasheet

Package characteristics STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC
124/132 DocID022799 Rev 6
Table 71. WLCSP63, 0.400 mm pitch wafer level chip size package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min Typ Max Min Typ Max
A 0.540 0.570 0.600 0.0213 0.0224 0.0236
A1 0.190 0.0075
A2 0.380 0.0150
A3 0.025 0.0010
Øb 0.240 0.270 0.300 0.0094 0.0106 0.0118
D 3.193 3.228 3.263 0.1257 0.1271 0.1285
E 4.129 4.164 4.199 0.1626 0.1639 0.1653
e 0.400 0.0157
e1 2.400 0.0945
e2 3.200 0.1260
F 0.414 0.0163
G 0.482 0.0190
aaa 0.100 0.0039
bbb 0.100 0.0039
ccc 0.100 0.0039
ddd 0.050 0.0020
eee 0.050 0.0020