Datasheet

DocID022799 Rev 6 123/132
STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC Package characteristics
131
Figure 45. WLCSP63, 0.400 mm pitch wafer level chip size package outline
1. Drawing is not to scale.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Bottom view
Bumb side
A1 Ball location
Side view
Top view
Wafer back Side
A1 reference
location
Detail A
(rotated 90 °)
Detail A
Seating plane
Front view
e1
F
G
e2
e
G
F
e
D
E
A2
A
A
Bump
A2
A3
bbb
BBB
FFF
A1
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