Datasheet

Package characteristics STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC
112/132 DocID022799 Rev 6
7 Package characteristics
7.1 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 34. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package outline
1. Drawing is not to scale.
e
IDENTIFICATION
PIN 1
GAUGE PLANE
0.25 mm
SEATING
PLANE
D
D1
D3
E3
E1
E
K
ccc
C
C
1
25
26
100
76
75
51
50
1L_ME_V3
A2
A
A1
L1
L
c
b
A1