Datasheet

Package characteristics STM32L151x6/8/B, STM32L152x6/8/B
122/131 DocID17659 Rev 9
Figure 43. Thermal resistance
7.2.1 Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
PD (mW)
Temperature(°C)
0.00
500.00
1000.00
1500.00
2000.00
2500.00
3000.00
100 75 50 25 0
UQFN48 7x7mm
LQFP48 7x7mm
LQFP64 10x10mm
LQFP100 14x14mm
UFBGA100 7x7mm
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