Datasheet

Revision history STM32L151x6/8/B, STM32L152x6/8/B
130/131 DocID17659 Rev 9
12-Nov-2013
9
(continued)
Updated Table 54: ADC characteristics and Figure 27: Typical
connection diagram using the ADC.
Table 58: Temperature sensor calibration values was previously in
Section 3.10.1: Temperature sensor. Updated Table 59:
Temperature sensor characteristics.
In Table 61: Comparator 2 characteristics, parameter dThreshold/dt,
replaced any occurrence of “VREF+” by “V
REFINT
”Updated
Table 63: LQPF100 14 x 14 mm, 100-pin low-profile quad flat
package mechanical data, Table 64: LQFP64 10 x 10 mm 64-pin
low-profile quad flat package mechanical data, Table 65: LQFP48 7
x 7 mm, 48-pin low-profile quad flat package mechanical data and
Table 66: UFQFPN48 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch
quad flat no-lead package mechanical data.
Updated Figure 33: Recommended footprint.
Updated Figure 41: TFBGA64 - 5.0x5.0x1.2 mm, 0.5 mm pitch, thin
fine-pitch ball grid array package outline title.
Remove minimum and typical values of A dimension in Table 67:
UFBGA100 7 x 7 x 0.6 mm 0.5 mm pitch, ultra thin fine-pitch ball
grid array package mechanical data
Deleted second footnote in Figure 39: Recommended footprint.
Updated Section 8: Part numbering title and added first sentence.
Changed BOR disabled option identifier in Table 70: Ordering
information scheme.
Table 71. Document revision history (continued)
Date Revision Changes