Datasheet

Package characteristics STM32L100C6, STM32L100R8/RB
98/102 DocID024295 Rev 1
7.2 Thermal characteristics
The maximum chip-junction temperature, T
J
max, in degrees Celsius, may be calculated
using the following equation:
T
J
max = T
A
max + (P
D
max × Θ
JA
)
Where:
• T
A
max is the maximum ambient temperature in ° C,
•Θ
JA
is the package junction-to-ambient thermal resistance, in ° C/W,
• P
D
max is the sum of P
INT
max and P
I/O
max (P
D
max = P
INT
max + P
I/O
max),
• P
INT
max is the product of I
DD
and V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/O
max represents the maximum power dissipation on output pins where:
P
I/O
max = Σ (V
OL
× I
OL
) + Σ((V
DD
– V
OH
) × I
OH
),
taking into account the actual V
OL
/ I
OL
and V
OH
/ I
OH
of the I/Os at low and high level in the
application.
Figure 30. Thermal resistance
Table 61. Thermal characteristics
Symbol Parameter Value Unit
Θ
JA
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
45
°C/W
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
16
PD (mW)
Temperature(°C)
0.00
500.00
1000.00
1500.00
2000.00
2500.00
3000.00
100 75 50 25 0
UQFN48 7x7mm
LQFP64 10x10mm
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