Datasheet

Package characteristics STM32L100C6, STM32L100R8/RB
96/102 DocID024295 Rev 1
Figure 28. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
1. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
1. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
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