Datasheet

Electrical characteristics STM32L100C6, STM32L100R8/RB
86/102 DocID024295 Rev 1
Figure 23. Maximum dynamic current consumption on V
DDA
supply pin during ADC
conversion
General PCB design guidelines
Power supply decoupling should be performed as shown in the following figure The 10 nF
capacitors should be ceramic (good quality). They should be placed as close as possible to
the chip.
ADC clock
Sampling (n cycles)
Conversion (12 cycles)
I
DDA
1300 µA
1700 µA
Table 54. R
AIN
max for f
ADC
= 16 MHz
(1)
Ts
(cycles)
Ts
(µs)
R
AIN
max (kohm)
Multiplexed channels Direct channels
2.4 V < V
DDA
< 3.6 V 1.8 V < V
DDA
< 2.4 V 2.4 V < V
DDA
< 3.3 V 1.8 V < V
DDA
< 2.4 V
4 0.25 Not allowed Not allowed 0.7 Not allowed
9 0.5625 0.8 Not allowed 2.0 1.0
16 1 2.0 0.8 4.0 3.0
24 1.5 3.0 1.8 6.0 4.5
48 3 6.8 4.0 15.0 10.0
96 6 15.0 10.0 30.0 20.0
192 12 32.0 25.0 50.0 40.0
384 24 50.0 50.0 50.0 50.0
1. Guaranteed by design, not tested in production.