Datasheet

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STM32F303xB STM32F303xC Electrical characteristics
118
6.3 Operating conditions
6.3.1 General operating conditions
Table 22. General operating conditions
Symbol Parameter Conditions Min Max Unit
f
HCLK
Internal AHB clock frequency 0 72
MHzf
PCLK1
Internal APB1 clock frequency 0 36
f
PCLK2
Internal APB2 clock frequency 0 72
V
DD
Standard operating voltage 2 3.6 V
V
DDA
Analog operating voltage
(OPAMP and DAC not used)
Must have a potential
equal to or higher than
V
DD
23.6
V
Analog operating voltage
(OPAMP and DAC used)
2.4 3.6
V
BAT
Backup operating voltage 1.65 3.6 V
V
IN
I/O input voltage
TC I/O –0.3 V
DD
+0.3
V
TTa I/O –0.3 V
DDA
+0.3
FT and FTf I/O
(1)
1. To sustain a voltage higher than V
DD
+0.3 V, the internal pull-up/pull-down resistors must be disabled.
–0.3 5.5
BOOT0 0 5.5
P
D
Power dissipation at T
A
=
85 °C for suffix 6 or T
A
=
105 °C for suffix 7
(2)
2. If T
A
is lower, higher P
D
values are allowed as long as T
J
does not exceed T
Jmax
(see Section 7.2: Thermal
characteristics).
LQFP100 - 488
mWLQFP64 - 444
LQFP48 - 364
T
A
Ambient temperature for 6
suffix version
Maximum power
dissipation
–40 85
°C
Low power dissipation
(3)
3. In low power dissipation state, T
A
can be extended to this range as long as T
J
does not exceed T
Jmax
(see
Section 7.2: Thermal characteristics).
–40 105
Ambient temperature for 7
suffix version
Maximum power
dissipation
–40 105
°C
Low power dissipation
(3)
–40 125
T
J Junction temperature range
6 suffix version –40 105
°C
7 suffix version –40 125