Datasheet

DocID023353 Rev 7 123/133
STM32F303xB STM32F303xC Package characteristics
129
Figure 38. LQFP64 recommended footprint
1. Dimensions are in millimeters.
c 0.09 0.20 0.0035 0.0079
D 11.80 12.00 12.20 0.4646 0.4724 0.4803
D1 9.80 10.00 10.20 0.3858 0.3937 0.4016
D3 7.50 0.2953
E 11.80 12.00 12.20 0.4646 0.4724 0.4803
E1 9.80 10.00 10.20 0.3858 0.3937 0.4016
E3 7.50 0.2953
e 0.50 0.0197
L 0.45 0.60 0.75 0.0177 0.0236 0.0295
L1 1.00 0.0394
K 0°3.5°7° 0°3.5°7°
ccc 0.08 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 77. LQFP64 – 10 x 10 mm low-profile quad flat package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
48
3249
64 17
116
1.2
0.3
33
10.3
12.7
10.3
0.5
7.8
12.7
ai14909b