Datasheet

STM32F20xxx Description

DocID15818 Rev 11 13/178

Operating temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C

Junction temperature: –40 to + 125 °C

Package LQFP64

LQFP64

WLCSP64

LQFP6

LQFP64

WLCSP6

4+2

LQFP100 LQFP144

1. For the LQFP100 package, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip

Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not

available in this package.

2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.

3. On devices in WLCSP64+2 package, if IRROFF is set to V

, the supply voltage can drop to 1.7 V when the device operates in the 0 to 70 °C temperature

range using an external power supply supervisor (see Section 3.16).

Table 2. STM32F205xx features and peripheral counts (continued)

Peripherals STM32F205Rx STM32F205Vx STM32F205Zx

Table 3. STM32F207xx features and peripheral counts

Peripherals STM32F207Vx STM32F207Zx STM32F207Ix

Flash memory in Kbytes 256 512 768 1024 256 512 768 1024 256 512 768 1024

SRAM in Kbytes

System

(SRAM1+SRAM2)

128

(112+16)

Backup 4

FSMC memory controller Yes

(1)

Ethernet Yes

Timers

General-purpose 10

Advanced-control 2

Basic 2

IWDG Yes

WWDG Yes

RTC Yes

Random number generator Yes