Datasheet

Package characteristics STM32F103xF, STM32F103xG
110/120 Doc ID 16554 Rev 3
Figure 61. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline
1. Drawing is not to scale.
Table 68. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min Typ Max Typ Min Max
A1.700.0669
A1 0.21 0.0083
A2 1.07 0.0421
A3 0.27 0.0106
A4 0.85 0.0335
b 0.35 0.40 0.45 0.0138 0.0157 0.0177
D 9.85 10.00 10.15 0.3878 0.3937 0.3996
D1 8.80 0.3465
E 9.85 10.00 10.15 0.3878 0.3937 0.3996
E1 8.80 0.3465
e0.80 0.0315
F0.60 0.0236
ddd 0.10 0.0039
eee 0.15 0.0059
fff 0.08 0.0031
Seating plane
C
A2
A4
A3
Cddd
A1
A
B
A
D1
e
F
D
F
E1
E
e
M
eee
M
CAB
Cfff
(144 balls)Øb
M
Ø
Ø
X3_ME
Ball A1