Datasheet

STM32F103xF, STM32F103xG Package characteristics
Doc ID 16554 Rev 3 109/120
6 Package characteristics
6.1 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 60. Recommended PCB design rules (0.80/0.75 mm pitch BGA
Dpad
Dsm
Dpad 0.37 mm
Dsm
0.52 mm typ. (depends on solder mask
registration tolerance
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
Solder paste 0.37 mm aperture diameter
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