Datasheet

STM32F103xC, STM32F103xD, STM32F103xE Electrical characteristics
Doc ID 14611 Rev 8 109/130
Figure 61. 12-bit buffered /non-buffered DAC
1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
Offset
(2)
Offset error
(difference between
measured value at Code
(0x800) and the ideal value =
V
REF+
/2)
±10 mV
Given for the DAC in 12-bit
configuration
±3 LSB
Given for the DAC in 10-bit at V
REF+
= 3.6 V
±12 LSB
Given for the DAC in 12-bit at V
REF+
= 3.6 V
Gain
error
(2)
Gain error ±0.5 %
Given for the DAC in 12bit
configuration
t
SETTLING
(2)
Settling time (full scale: for a
10-bit input code transition
between the lowest and the
highest input codes when
DAC_OUT reaches final
value ±1LSB
34 µsC
LOAD
50 pF, R
LOAD
5 kΩ
Update
rate
(2)
Max frequency for a correct
DAC_OUT change when
small variation in the input
code (from code i to i+1LSB)
1MS/sC
LOAD
50 pF, R
LOAD
5 kΩ
t
WAKEUP
(2)
Wakeup time from off state
(Setting the ENx bit in the
DAC Control register)
6.5 10 µs
C
LOAD
50 pF, R
LOAD
5 kΩ
input code between lowest and
highest possible ones.
PSRR+
(1)
Power supply rejection ratio
(to V
DDA
) (static DC
measurement
–67 –40 dB No R
LOAD
, C
LOAD
= 50 pF
1. Guaranteed by design, not tested in production.
2. Guaranteed by characterization, not tested in production.
Table 63. DAC characteristics (continued)
Symbol Parameter Min Typ Max Unit Comments
R
LOAD
C
LOAD
Buffered/Non-buffered DAC
DACx_OUT
Buffer(1)
12-bit
digital to
analog
converter
ai17157