Datasheet

STM32F103xF, STM32F103xG Electrical characteristics
Doc ID 16554 Rev 3 59/120
Low-speed internal (LSI) RC oscillator
Wakeup time from low-power mode
The wakeup times given in Table 27 is measured on a wakeup phase with a 8-MHz HSI RC
oscillator. The clock source used to wake up the device depends from the current operating
mode:
Stop or Standby mode: the clock source is the RC oscillator
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
All timings are derived from tests performed under ambient temperature and V
DD
supply
voltage conditions summarized in
Ta ble 10.
Table 26. LSI oscillator characteristics
(1)
1. V
DD
= 3 V, T
A
= –40 to 105 °C unless otherwise specified.
Symbol Parameter Min Typ Max Unit
f
LSI
(2)
2. Based on characterization, not tested in production.
Frequency 30 40 60 kHz
t
su(LSI)
(3)
3. Guaranteed by design, not tested in production.
LSI oscillator startup time - - 85 µs
I
DD(LSI)
(3)
LSI oscillator power consumption - 0.65 1.2 µA
Table 27. Low-power mode wakeup timings
Symbol Parameter Typ Unit
t
WUSLEEP
(1)
1. The wakeup times are measured from the wakeup event to the point in which the user application code
reads the first instruction.
Wakeup from Sleep mode 1.8 µs
t
WUSTOP
(1)
Wakeup from Stop mode (regulator in run mode) 3.6
µs
Wakeup from Stop mode (regulator in low power mode) 5.4
t
WUSTDBY
(1)
Wakeup from Standby mode 50 µs