Datasheet

Package characteristics STM32F103xC, STM32F103xD, STM32F103xE
116/130 Doc ID 14611 Rev 8
Figure 66. BGA pad footprint
Table 69. Recommended PCB design rules (0.5mm pitch BGA)
Dimension Recommended values
Dpad ∅
= 300 µm (circular) - 250 µm recommended
Dsm ∅ = 340 µm min (for 300 µm diameter pad)
PCD pad size Cu - Ni (2-6 µm) - Au (0.2 µm max)
– Non solder mask defined
– Micro via under bump allowed
$PAD
$SM
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