Datasheet
Package characteristics STM32F103xC, STM32F103xD, STM32F103xE
112/130 Doc ID 14611 Rev 8
Figure 62. BGA pad footprint
Table 65. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
Dimension Recommended values
Dpad ∅
= 0.37 mm
Dsm ∅ = 0.52 mm typ. (depends on solder mask registration tolerance)
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
$PAD
$SM
-36