Datasheet

STM32F103x4, STM32F103x6 Package characteristics
Doc ID 15060 Rev 6 81/90
Figure 45. Recommended PCB design rules for pads (0.5 mm pitch BGA)
1. Non solder mask defined (NSMD) pads are recommended
2. 4 to 6 mils solder paste screen printing process
Pitch
0.5 mm
D pad 0.27 mm
Dsm
0.35 mm typ (depends on
the soldermask registration
tolerance)
Solder paste
0.27 mm aperture diameter
Dpad
Dsm
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