Datasheet

Electrical characteristics STM32F101xF, STM32F101xG
94/108 Doc ID 17143 Rev 2
The formula above (Equation 1) is used to determine the maximum external impedance
allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).
Table 56. R
AIN
max for f
ADC
= 14 MHz
(1)
1. Guaranteed by design, not tested in production.
T
s
(cycles) t
S
(µs) R
AIN
max (k)
1.5 0.11 0.4
7.5 0.54 5.9
13.5 0.96 11.4
28.5 2.04 25.2
41.5 2.96 37.2
55.5 3.96 50
71.5 5.11 NA
239.5 17.1 NA
Table 57. ADC accuracy - limited test conditions
(1)(2)
1. ADC DC accuracy values are measured after internal calibration.
2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
INJ(PIN)
and I
INJ(PIN)
in Section 5.3.14 does not
affect the ADC accuracy.
Symbol Parameter Test conditions Typ Max
(3)
3. Preliminary values.
Unit
ET Total unadjusted error
f
PCLK2
= 28 MHz,
f
ADC
= 14 MHz, R
AIN
< 10 k,
V
DDA
= 3 V to 3.6 V, T
A
= 25 °C
Measurements made after
ADC calibration
V
REF+
= V
DDA
±1.3 ±2
LSB
EO Offset error ±1 ±1.5
EG Gain error ±0.5 ±1.5
ED Differential linearity error ±0.7 ±1
EL Integral linearity error ±0.8 ±1.5