Datasheet

Electrical characteristics STM32F101xF, STM32F101xG
50/108 Doc ID 17143 Rev 2
Low-speed external user clock generated from an external source
The characteristics given in Tabl e 2 2 result from tests performed using an low-speed
external clock source, and under ambient temperature and supply voltage conditions
summarized in Table 10 .
Table 21. High-speed external user clock characteristics
Symbol Parameter Conditions Min Typ Max Unit
f
HSE_ext
User external clock source
frequency
(1)
1. Guaranteed by design, not tested in production
1825MHz
V
HSEH
OSC_IN input pin high level
voltage
0.7V
DD
V
DD
V
V
HSEL
OSC_IN input pin low level
voltage
V
SS
0.3V
DD
t
w(HSE)
t
w(HSE)
OSC_IN high or low time
(1)
16
ns
t
r(HSE)
t
f(HSE)
OSC_IN rise or fall time
(1)
20
C
in(HSE)
OSC_IN input capacitance
(1)
5pF
DuCy
(HSE)
Duty cycle 45 55 %
I
L
OSC_IN Input leakage current V
SS
 V
IN
 V
DD
±1 µA
Table 22. Low-speed user external clock characteristics
Symbol Parameter Conditions Min Typ Max Unit
f
LSE_ext
User external clock source
frequency
(1)
1. Guaranteed by design, not tested in production.
32.768 1000 kHz
V
LSEH
OSC32_IN input pin high
level voltage
0.7V
DD
V
DD
V
V
LSEL
OSC32_IN input pin low level
voltage
V
SS
0.3V
DD
t
w(LSE)
t
w(LSE)
OSC32_IN high or low time
(1)
450
ns
t
r(LSE)
t
f(LSE)
OSC32_IN rise or fall time
(1)
50
C
in(LSE)
OSC32_IN input
capacitance
(1)
5pF
DuCy
(LSE)
Duty cycle 30 70 %
I
L
OSC32_IN Input leakage
current
V
SS
 V
IN
 V
DD
±1 µA