Datasheet

STM32F101xF, STM32F101xG Electrical characteristics
Doc ID 17143 Rev 2 43/108
Table 16. Maximum current consumption in Sleep mode, code running from Flash
or RAM
Symbol Parameter Conditions f
HCLK
Max
(1)
1. Based on characterization, tested in production at V
DD
max, f
HCLK
max with peripherals enabled.
Unit
T
A
= 85 °C
I
DD
Supply current in
Sleep mode
External clock
(2)
all
peripherals enabled
2. External clock is 8 MHz and PLL is on when f
HCLK
> 8 MHz.
36 MHz 27.5
mA
24 MHz 20
16 MHz 15
8 MHz 9
External clock
(2)
, all
peripherals disabled
36 MHz 6.9
24 MHz 5.9
16 MHz 5.4
8 MHz 4.7
Table 17. Typical and maximum current consumptions in Stop and Standby modes
Symbol Parameter Conditions
Typ
(1)
Max
Unit
V
DD
/ V
BAT
= 2.0 V
V
DD
/ V
BAT
= 2.4 V
V
DD
/V
BAT
= 3.3 V
T
A
=
85 °C
I
DD
Supply current
in Stop mode
Regulator in Run mode,
Low-speed and high-speed internal RC
oscillators and high-speed oscillator
OFF (no independent watchdog)
34.5 35 379
µA
Regulator in Low-power mode,
Low-speed and high-speed internal RC
oscillators and high-speed oscillator
OFF (no independent watchdog)
24.5 25 365
Supply current
in Standby
mode
Low-speed internal RC oscillator and
independent watchdog ON
33.8
Low-speed internal RC oscillator ON,
independent watchdog OFF
2.8 3.6
Low-speed internal RC oscillator and
independent watchdog OFF, low-speed
oscillator and RTC OFF
1.9 2.1 5
(2)
I
DD_VBAT
Backup domain
supply current
Low-speed oscillator and RTC ON 1.05 1.1 1.4 2
(2)
1. Typical values are measured at T
A
= 25 °C.
2. Based on characterization, not tested in production.