Datasheet

Description STM32F101xF, STM32F101xG
14/108 Doc ID 17143 Rev 2
2.2 Full compatibility throughout the family
The STM32F101xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are
identified as low-density devices, the STM32F101x8 and STM32F101xB are referred to as
medium-density devices, the STM32F101xC, STM32F101xD, STM32F101xE are referred
to as high-density devices, and the STM32F101xF and STM32F101xG are referred to as
XL-density devices.
Low-, high-density and XL-density devices are an extension of the STM32F101x8/B
medium-density devices, they are specified in the STM32F101x4/6, STM32F101xC/D/E and
STM32F101xF/G datasheets, respectively.
Low-density devices feature lower Flash memory and RAM capacities, less timers and
peripherals. High-density devices have higher Flash memory and RAM densities, and
additional peripherals like FSMC and DAC. XL-density devices bring greater Flash and RAM
capacities, and more features, namely an MPU, a higher number of timers and a dual bank
Flash memory, while remaining fully compatible with the other members of the family.
The STM32F101x4, STM32F101x6, STM32F101xC, STM32F101xD, STM32F101xE,
STM32F101xF and STM32F101xG are a drop-in replacement for the STM32F101x8/B
devices, allowing the user to try different memory densities and providing a greater degree
of freedom during the development cycle.
Moreover, the STM32F101xx access line family is fully compatible with all existing
STM32F103xx performance line and STM32F102xx USB access line devices.
Table 3. STM32F101xx family
Pinout
Memory size
Low-density devices Medium-density devices High-density devices XL-density devices
16 KB
Flash
32 KB
Flash
(1)
64 KB
Flash
128 KB
Flash
256 KB
Flash
384 KB
Flash
512 KB
Flash
768 KB
Flash
1 MB
Flash
4 KB RAM 6 KB RAM 10 KB RAM 16 KB RAM
32 KB
RAM
48 KB
RAM
48 KB
RAM
80 KB
RAM
80 KB
RAM
144
5 × USARTs
4 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I
2
Cs,
1 × ADC, 1 × DAC
FSMC (100 and 144 pins)
5 × USARTs
10 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I
2
Cs,
1 × ADC, 1 × DAC
FSMC (100 and 144
pins), Cortex-M3 with
MPU, Dual bank Flash
memory
100
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I2Cs,
1 × ADC
64
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
2
C
1 × ADC
48
36
1. For orderable part numbers that do not show the A internal code after the temperature range code (6), the reference
datasheet for electrical characteristics is that of the STM32F101x8/B medium-density devices.