Datasheet

STM32F101xF, STM32F101xG Description
Doc ID 17143 Rev 2 11/108
2.1 Device overview
The STM32F101xx XL-density access line family offers devices in 3 different package types:
from 64 pins to 144 pins. Depending on the device chosen, different sets of peripherals are
included, the description below gives an overview of the complete range of peripherals
proposed in this family.
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Figure 1 shows the general block diagram of the device family.
Table 2. STM32F101xF and STM32F101xG features and peripheral counts
Peripherals STM32F101Rx STM32F101Vx STM32F101Zx
Flash memory 768 KB 1 MB 768 KB 1 MB 768 KB 1 MB
SRAM in Kbytes 80 80 80
FSMC No Yes Yes
Timers
General-purpose 10
Basic 2
Communication
interfaces
SPI 3
I
2
C2
USART 5
GPIOs 51 80 112
12-bit ADC
Number of channels
2
16
2
16
2
16
12-bit DAC
Number of channels
2
2
CPU frequency 36 MHz
Operating voltage 2.0 to 3.6 V
Operating temperatures
Ambient temperature: –40 to +85 °C (see Ta bl e 10 )
Junction temperature: –40 to +105 °C (see Tab le 1 0)
Package LQFP64 LQFP100
(1)
1. For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a
multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND
Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available
in this package.
LQFP144