Datasheet

Revision history STM32F101x8, STM32F101xB
86/90 DocID13586 Rev 16
14-Mar-2008 5
Figure 2: Clock tree on page 13 added.
CRC added (see CRC (cyclic redundancy check) calculation unit on
page 9 and Figure 8: Memory map on page 29 for address).
Maximum T
J
value given in Table 7: Thermal characteristics on page 33.
P
D
, T
A
and T
J
added, t
prog
values modified and t
prog
description clarified in
Table 27: Flash memory characteristics on page 51.
I
DD
modified in Table 15: Typical and maximum current consumptions in
Stop and Standby modes on page 39.
ACC
HSI
modified in Table 23: HSI oscillator characteristics on page 49,
note 2 removed.
t
RET
modified in Table 28: Flash memory endurance and data retention.
V
NF(NRST)
unit corrected in Table 37: NRST pin characteristics on
page 60.
Table 41: SPI characteristics on page 65 modified.
I
VREF
added in Table 42: ADC characteristics on page 68.
Table 44: ADC accuracy - limited test conditions added. Table 45: ADC
accuracy modified.
LQFP100 package specifications updated (see Section 6: Package
characteristics on page 73).
Recommended LQFP100, LQFP64, LQFP48 and VFQFPN36 footprints
added (see Figure 42, Figure 44, Figure 46 and Figure 40).
Section 6.2: Thermal characteristics on page 80 modified.
Appendix A: Important notes removed.
21-Mar-2008 6
Small text changes.
In Table 28: Flash memory endurance and data retention:
–N
END
tested over the whole temperature range
– cycling conditions specified for t
RET
–t
RET
min modified at T
A
= 55 °C
Figure 2: Clock tree corrected. Figure 8: Memory map clarified.
V
25
, Avg_Slope and T
L
modified in Table 46: TS characteristics.
CRC feature removed.
22-May-2008 7
Section 1: Introduction modified, Section 2.2: Full compatibility throughout
the family added. CRC feature added.
I
DD_VBAT
removed from Table 21: Typical current consumption in Standby
mode on page 42.
Values added to Table 40: SCL frequency (fPCLK1= 36 MHz, VDD_I2C =
3.3 V) on page 64.
Figure 30: SPI timing diagram - slave mode and CPHA = 0 on page 66
modified. Equation 1 corrected.
Section 6.2.2: Evaluating the maximum junction temperature for an
application on page 81 added.
Axx option added to Table 53: Ordering information scheme on page 82.
Table 54. Document revision history (continued)
Date Revision Changes