Datasheet

Revision history STM32F101x8, STM32F101xB
84/90 DocID13586 Rev 16
18-Oct-2007 3
V
ESD(CDM)
value added to Table 31: ESD absolute maximum ratings.
Note added below Table 10: Embedded reset and power control block
characteristics. and below Table 21: HSE 4-16 MHz oscillator
characteristics.
Note added below Table 35: Output voltage characteristics and V
OH
parameter description modified.
Table 42: ADC characteristics and Table 44: ADC accuracy - limited test
conditions modified.
Figure 33: ADC accuracy characteristics modified.
Packages are ECOPACK® compliant.
Tables modified in Section 5.3.5: Supply current characteristics.
ADC and ANTI_TAMPER signal names modified (see Table 4: Medium-
density STM32F101xx pin definitions). Table 4: Medium-density
STM32F101xx pin definitions modified. Note 4 removed and values
updated in Table 21: Typical current consumption in Standby mode.
V
hys
modified in Table 34: I/O static characteristics.
Updated: Table 29: EMS characteristics and Table 30: EMI
characteristics.
t
VDD
modified in Table 9: Operating conditions at power-up / power-down.
Typical values modified, note 2 modified and note 3 removed in Table 25 :
Low-power mode wakeup timings.
Maximum current consumption Table 12 , Table 13 and Table 14 updated.
Values added and notes added in Table 15: Typical and maximum current
consumptions in Stop and Standby modes.
On-chip peripheral current consumption on page 44 added.
Package mechanical data inch values are calculated from mm and
rounded to 4 decimal digits (see Section 6: Package characteristics).
V
prog
added to Table 27: Flash memory characteristics.
T
S_temp
added to Table 46: TS characteristics.
T
S_vrefint
added to Table 11: Embedded internal reference voltage.
Handling of unused pins specified in General input/output characteristics
on page 55. All I/Os are CMOS and TTL compliant.
Table 4: Medium-density STM32F101xx pin definitions: table clarified and
Note 7 modified.
Internal LSI RC frequency changed from 32 to 40 kHz (see Table 24: LSI
oscillator characteristics). Values added to Table 25: Low-power mode
wakeup timings. N
END
modified in Table 28: Flash memory endurance
and data retention.
Option byte addresses corrected in Figure 8: Memory map.
ACC
HSI
modified in Table 23: HSI oscillator characteristics.
t
JITTER
removed from Table 26: PLL characteristics.
Appendix A: Important notes on page 71 added.
Added: Figure 13, Figure 14, Figure 16 and Figure 18.
Table 54. Document revision history (continued)
Date Revision Changes