Datasheet

Description STM32F101x4, STM32F101x6
12/79 Doc ID 15058 Rev 5
Figure 1. STM32F101xx Low-density access line block diagram
1. AF = alternate function on I/O port pin.
2. T
A
= –40 °C to +85 °C (junction temperature up to 105 °C).
Temp sensor
PA[15:0]
EXTI
W W D G
NVIC
12bit ADC
SWD
16AF
JTDI
JTCK/SWCLK
JTMS/SWDIO
NJTRST
JTDO
NRST
V
DD
= 2 to 3.6 V
80AF
PB[15:0]
PC[15:0]
AHB2
SRAM
WAKEUP
GPIOA
GPIOB
GPIOC
F
max
: 3 6 MHz
V
SS
GP DMA
TIM2
TIM3
XTAL OSC
4-16 MHz
XTAL 32 kHz
OSC_IN
OSC_OUT
OSC32_OUT
OSC32_IN
PLL &
APB1 : F
max
=24 / 36 MHz
PCLK1
HCLK
CLOCK
MANAGT
PCLK 2
VOLT. REG.
3.3V TO 1.8V
POWER
Backu p i nterf ace
as AF
6 KB
RTC
RC 8 MHz
Cortex M3 CPU
USART1
USART2
7 channels
Backup
reg
SCL,SDA,SMBA
I2C
as AF
PD[3:0]
GPIOD
AHB: F
max
=36 MHz
4 Channels
4 Channels
FCLK
RC 42 kHz
Stand by
IWDG
@VDD
@VBAT
POR / PDR
SUPPLY
@VDDA
VDDA
VSSA
@VDDA
V
BAT
RX,TX, CTS, RTS,
Smartcard as AF
RX,TX, CTS, RTS,
APB2 : F
max
= 36 MHz
NVIC
SPI
MOSI,MISO,
SCK,NSS as AF
IF
interface
@VDDA
SUPERVISION
PVD
Rst
Int
@VDD
AHB2
APB2
APB 1
AWU
TAMPER-RTC
Flash 32 KB
BusM atrix
64 bit
Interface
Ibus
Dbus
pbus
obl
Flash
Trace
controller
System
ai15173c
TRACECLK
TRACED[0:3]
as AS
SW/JTAG
TPIU
Trace/trig
CK, SmartCard as AF