Datasheet

Package characteristics STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
78/88 Doc ID 16455 Rev 7
Figure 41. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
Table 50. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min Typ Max Min Typ Max
A 1.200 0.0472
A1 0.150 0.0059
A2 0.785 0.0309
A3 0.200 0.0079
A4 0.600 0.0236
b 0.250 0.300 0.350 0.0098 0.0118 0.0138
D 4.850 5.000 5.150 0.1909 0.1969 0.2028
D1 3.500 0.1378
E 4.850 5.000 5.150 0.1909 0.1969 0.2028
E1 3.500 0.1378
e 0.500 0.0197
F 0.750 0.0295
ddd 0.080 0.0031
eee 0.150 0.0059
fff 0.050 0.0020
A3
A4
A2
A1
A
Seating
plane
B
A
D
D1
e
F
F
E1 E
e
H
G
F
E
D
C
B
A
123 45678
A1 ball pad corner
Øb (64 balls)
Bottom view
C
ME_R8