Datasheet

STM1810/1811/1812/1813/1815/1816/1817/1818 Maximum rating
Doc ID11464 Rev 8 17/25
4 Maximum rating
Stressing the device above the rating listed in Ta bl e 7 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the “Operating” sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics™ “SURE Program” and other relevant
quality documents.
Table 7. Absolute maximum ratings
Symbol Parameter Value Unit
T
STG
Storage temperature (V
CC
Off) –55 to 150 °C
T
SLD
(1)
1. Reflow at peak temperature of 255 °C to 260 °C for < 30 seconds (total thermal budget not to exceed 180 °C
for between 90 to 150 seconds).
Lead solder temperature for 10 seconds 260 °C
V
IO
Input or output voltage –0.3 to V
CC
+0.3 V
V
CC
Supply voltage –0.3 to 7.0 V
I
O
Output current 20 mA
P
D
Power dissipation 320 mW