Datasheet
Table Of Contents
- Figure 1. Packages
- 1 Summary Description
- 2 Pin Descriptions
- 3 Operation
- 4 Typical Operating Characteristics
- Figure 7. Supply Current vs. Input Voltage
- Figure 8. Supply Current vs. Ambient Temperature
- Figure 9. Output Detect Delay Time vs. Ambient Temperature
- Figure 10. Output Release Delay Time vs. Ambient Temperature
- Figure 11. Maximum Transient Duration vs. Reset Threshold Overdrive
- Figure 12. Detect, Release Voltage vs. Ambient Temperature for VTH- = 3.4V
- Figure 13. N-channel Driver Output Current vs. VDS
- Figure 14. N-channel Driver Output Current vs. Input Voltage for VDS = 0.5V
- 5 Maximum Rating
- 6 DC and AC Parameters
- 7 Package Mechanical
- Figure 17. SOT23-3 - 3-lead Small Outline Transistor Package Outline
- Table 6. SOT23-3 - 3-lead Small Outline Transistor Package Mechanical Data
- Figure 18. SOT323-3 (SC70-3) - 3-lead Small Outline Transistor Package Outline
- Table 7. SOT323-3 (SC70-3) - 3-lead Small Outline Transistor Package Mechanical Data
- 8 Part Numbering
- 9 Revision History
STM1061 Package Mechanical
17/23
7 Package Mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 17. SOT23-3 – 3-lead Small Outline Transistor Package Outline
1. Drawing is not to scale.
SOT23-3
0.10 C
A
A2
A1
3X
C
C
L1
θ
L
C
e1
D
e
3X b
E
M
0.15
CAB
B
E1
A
M
0.20 C A B
1