Datasheet

STIEC45-XXAS Characteristics
Doc ID 16871 Rev 1 5/9
Figure 9. Leakage current versus junction temperature (typical values)
Figure 7. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead
Z
th(j a)
/R
th(j a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
t
P
(s)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S
CU
(cm²)
PCB FR4, copper thickness = 35 µm
R (°C/W)
th(j-a)
I
R
(nA)
1.E+00
1.E+01
1.E+02
1.E+03
25 50 75 100 125 150
V
R
=V
RM
T
j
(°C)