Datasheet

UM0984 Board description
Doc ID 17812 Rev 2 13/25
3.5 BOM
Table 2. Bill of materials
Index Quantity Ref. Value / generic part number Package / class Manufacturer
1 1 R1 5.1 Ω / 2 W Wirewound
or 4.7 Ω / 2 W Wirewound
2 2 R2, R3 51 kΩ / 5% / 0.25 W 1206
3 1 R4 3.9 Ω / 5% / 0.1 W 0805
4 1 R5 150 kΩ /1% / 0.1 W 0805
5 1 R6 43 kΩ / 1% / 0.1 W 0805
6 0 R7 Not assembled
7 1 R8 10 kΩ / 5% / 0.1 W 0805
8 0 R9 Not assembled
9 1 C1 100 nF / 305 VAC / X2 18 x 5 x 11 RM 15 EPCOS
10 1 C2 10 µF / 450 V D12.5 x 20 RM 5
11 1 C3 470 pF / 200 V 1206
12 1 C4 10 µF / 35 V / 105 °C D5 x 11 RM 2
13 1 C5 2.2 nF / 50 V 0805
14 1 C6 1 nF / 50 V 0805
15 2 C7, C10 100 nF / 50 V 0805
16 1 C8 470 µF / 35 V / low ESR D10 x 20 RM 5
17 1 C9 330 nF / 50 V 0805
18 0 C11 Not assembled
19 1 C12 1 nF / 250 VAC / 4 kV / Y1 RM 12
20 0 C13 Not assembled
21 1 C13A 22 µF / 450 V D16 x 20 RM 5
22 1 L1 CMC 2 x 10 mH UU9.8, RM 8 x 7 EPCOS
23 1 T1 EF20 - 1.41 mH EF20 WÜRTH ELEKTRONIK
24 0 DB1 Not assembled
25 1 DB1A 1 A / 800 V / bridge SO-DIL
26 1 D1 STTH1R06A SMA STMicroelectronics™
27 1 D2 1N4148 MINIMELF / SOD80
28 0 D3 Not assembled
29 1 D3A STPS2H100U SMB STMicroelectronics
30 1 IC1 VIPER26LN SO16N STMicroelectronics
31 1 IC2 L78L33AC SO8N STMicroelectronics