Datasheet

STCC08 Package information
11/13
4 Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 10. SO-8 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 1.75 0.069
A1 0.1 0.25 0.004 0.010
A2 1.25 0.049
b 0.28 0.48 0.011 0.019
C 0.17 0.23 0.007 0.009
D 4.80 4.90 5.00 0.189 0.193 0.197
E 5.80 6.00 6.20 0.228 0.236 0.244
E1 3.80 3.90 4.00 0.150 0.154 0.157
e 1.27 0.050
h 0.25 0.50 0.010 0.020
L 0.40 1.27 0.016 0.050
L1 1.04 0.041
k0°8°0°8°
ppp 0.10 0.004
Figure 10. Footprint dimensions
in mm(inches)
Figure 11. Marking
E1
D
8
4
1
5
E
e
A
A2
b
A1
ppp C
C
k
h x 45°
L
L1
Seating
Plane
C
6.8
(0.268)
4.2
(0.165)
1.27
(0.050)
0.6
(0.024)
â
XXXXX : Marking
ZZ : Manufacturing location
Y : Year
WW : week
z z y w w
x x x x x x
Pin 1
â
XXXXX : Marking
ZZ : Manufacturing location
Y : Year
WW : week
zz zz yy ww ww
xx xx xx xx xx xx
Pin 1