Datasheet

Maximum rating STBP120
14/36 Doc ID 15492 Rev 5
.
Figure 5. Maximum MOSFET current at T
A
= 85 °C for various PCB thermal
performance and T
J
= 125 °C
Table 3. Thermal data
Symbol Parameter Value Unit
R
thJA
Thermal resistance (junction to ambient)
204
(1)
82
(2)
1. The package is mounted on a 2-layers (1S) JEDEC board as per JESD51-7 without thermal vias
underneath the exposed pads.
2. The package is mounted on a 4-layers (2S2P) JEDEC board as per JESD51-7 with 2 thermal vias (one
underneath each exposed pad) as per JESD-51-5. Thermal vias connected from exposed pad to 1'st
buried copper plane of PCB.
°C/W
R
thJC
Thermal resistance (junction to case) 43 °C/W
AM00428b
R
thJA
[˚C/W]
I
(MOSFET)
[A]
0.70
0.90
1.10
1.30
1.50
1.70
1.90
2.10
50 100 150 200 250 300 350