Datasheet

Package mechanical data ST7538Q
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7 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Best thermal performance is achieved when slug is soldered to PCB.
It is recommended to have five solder dots (See Figure 27) without resist to connect the
Copper slug to the ground layer on the soldering side. Moreover it is recommitted to connect
the ground layer on the soldering side to another ground layer on the opposite side with 15
to 20 vias.
It is suggested to not use the PCB surface below the slug area to interconnect any pin
except ground pins.
Figure 26. ST7538Q slug drawing
Figure 27. Soldering information
Copper Slug
Solder plated
Lead frame
0.10mm ±0.05
D03IN1414
L
L1
L
A
B
L1
Solder dots
Cu plate
D03IN141
3
Package Sizes 10x10x1.4mm
A 2.00 mm
B 1.00 mm
L 6.00 mm
L1 (Copper plate) 10.00 mm
If PCB with ground layer, connect
copper plate with 15 to 20 vias