Datasheet

ST72321Rx ST72321ARx ST72321Jx
174/193
13.3 SOLDERING AND GLUEABILITY INFORMATION
Refer to JEDEC specification JSTD020D for a de-
scription of the recommended reflow oven profile
for these packages.
In order to meet environmental requirements, ST
offers this device in different grades of ECO-
PACK
®
packages, depending on their level of en-
vironmental compliance. ECOPACK
®
specifica-
tions, grade definitions and product status are
available at: www.st.com
. ECOPACK
®
is an ST
trademark.
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
■ Heraeus: PD945, PD955
■ Loctite: 3615, 3298