Datasheet

ST72321Rx ST72321ARx ST72321Jx
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13.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is
the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the applica-
tion.
Symbol Ratings Value Unit
R
thJA
Package thermal resistance (junction to ambient)
LQFP64 14x14
LQFP64 10x10
LQFP44 10x10
47
50
52
°C/W
P
D
Power dissipation
1)
500 mW
T
Jmax
Maximum junction temperature
2)
150 °C