Datasheet

Package information ST202EB, ST202EC, ST232EB, ST232EC
10/18 DocID6900 Rev 17
6 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
6.1 Package thermal characteristics
Table 9. Thermal characteristics
Package Symbol Value Board type Unit
SO16
Θ
JA
(1)
1. Θ
JA
is the package junction-to-ambient thermal resistance in ° C/W
115 1-layer board
°C/W
80 4-layer board
Θ
JC
(2)
2. Θ
JC
is the package junction-to-case thermal resistance in ° C/W
30 1-layer board
SO16L
Θ
JA
(1)
95 1-layer board
Θ
JC
(2)
30 1-layer board
TSSOP16
Θ
JA
(1)
140 1-layer board
95 2-layer board
Θ
JC
(2)
25 2-layer board