Datasheet

DocID17928 Rev 5 19/29
ST1S40 Application information
29
Figure 8. PCB layout guidelines
Input cap as close as possible
to VINSW pin
Star center for common ground
Short FB trace
VINA derived from Cin
To avoid dynamic voltage drop
Between VINA and VINSW
Short high switching
current loop
Via to connect the thermal pad
To bottom or inner ground plane