Datasheet

Package information SMTYF
6/8
2 Package information
● Case: JEDEC DO-221AC molded plastic over Planar junction
● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
● Polarity: Band indicates cathode
● Flammability: Epoxy rated UL94V-0
● RoHS package
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5. SMAflat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.95 0.088 0.116
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
L1 0.50 0.019
L2 0.50 0.019
Figure 11. SMAflat footprint dimensions
optimized for SMAflat
(1)
1. SMA footprint may also be used.
Figure 12. Marking information
D
A
L 2x
L
L2 2x
L1 2x
E
E1
b
c
1.20
(0.047)
1.20
(0.047)
3.12
(0.123)
5.52
(0.217)
1.52
(0.060)
millimeters
(inches)
y w w
e3
z
x x x
e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar (
unidirectional
devices only )