Datasheet

SMTYF Characteristics
5/8
Figure 7. Average power dissipation versus
ambient temperature
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
ciruit board FR4, S
Cu
= 1 cm
2
)
Figure 9. Thermal resistance junction to
ambient versus copper surface
under each lead
(printed circuit board FR4,
copper thickness
= 35 µm)
Figure 10. Leakage current versus junction
temperature (typical values)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0 25 50 75 100 125 150 175
P(W)
R
th(j-a)
=R
th(j-l)
R
th(j-a)
=200 °C/W
(PCB FR4, recommended pad layout)
T
amb
(°C)
Z
th(j-a)
/R
th(j-a)
0.00
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
On recommended pad
layout
t (S)
p
R
th(j-a)
(°C/W)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
S (cm )
CU
2
I (µA)
R
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
25 50 75 100 125 150 175
V
R
=V
RM
SMTYF5.0A
SMTYF12A
T (°C)
j