Datasheet

Characteristics SMP50 / SMTPA / TPA
2/11
1 Characteristics
Table 1. Compliant with the following standards
Standard
Peak Surge
Voltage
(V)
Waveform
Voltage
Required
peak current
(A)
Current
waveform
Minimum serial
resistor to meet
standard (Ω)
GR-1089 Core
First level
2500
1000
2/10 µs
10/1000 µs
500
100
2/10 µs
10/1000 µs
20
10
GR-1089 Core
Second level
5000 2/10 µs 500 2/10 µs 40
GR-1089 Core
Intra-building
1500 2/10 µs 100 2/10 µs 0
ITU-T-K20/K21
6000
1500
10/700 µs
150
37.5
5/310 µs
53
0
ITU-T-K20
(IEC61000-4-2)
8000
15000
1/60 ns
ESD contact discharge
ESD air discharge
0
0
VDE0433
4000
2000
10/700 µs
100
50
5/310 µs
21.5
0
VDE0878
4000
2000
1.2/50 µs
100
50
1/20 µs
0
0
IEC61000-4-5
4000
4000
10/700 µs
1.2/50 µs
100
100
5/310 µs
8/20 µs
21.5
0
FCC Part 68, lightning
surge type A
1500
800
10/160 µs
10/560 µs
200
100
10/160 µs
10/560 µs
12.5
6.5
FCC Part 68, lightning
surge type B
1000 9/720 µs 25 5/320 µs 0
Table 2. Absolute ratings (T
amb
= 25° C)
Symbol Parameter Value Unit
I
PP
Repetitive peak pulse current (see Figure 1)
10/1000 µs
8/20 µs
10/560 µs
5/310 µs
10/160 µs
1/20 µs
2/10 µs
50
150
55
65
75
100
100
A
I
FS
Fail-safe mode : maximum current
(1)
1. in fail safe mode, the device acts as a short circuit
8/20 µs 2.5 kA
I
TSM
Non repetitive surge peak on-state current
(sinusoidal)
t = 0.2 s
t = 1 s
t = 2 s
t = 15 mn
16
11.5
10
3.5
A
I
2
tI
2
t value for fusing
t = 16.6 ms
t = 20 ms
6.2
6.5
A
2
s
T
stg
T
j
Storage temperature range
Maximum junction temperature
-55 to 150
150
°C
T
L
Maximum lead temperature for soldering during 10 s. 260 °C